Electronics Forum | Wed Dec 19 09:24:21 EST 2012 | swag
Many times we manually add flux from the top side for good fill.
Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Tue Dec 18 10:14:14 EST 2012 | moshesh
In those cases where we have a 3.2mm thick, 16-layer board with several GND layers, do we still need ground connection to each and every layer (with thermal relief) or, skip part of the ground patterns? Will it help soldeing rising. I can't reach mor
Electronics Forum | Wed Dec 19 11:12:05 EST 2012 | aj
have you considered intrusive reflow? I ran a product similar to what you are describing and the only way we could get sufficient holefill consistently was by this process.... there may be obvious reasons why you cant but worth a shot if you can- it
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
Electronics Forum | Thu Jan 14 06:03:51 EST 2021 | manaik
Hello, We have recently bought ZipaTec select 250, we are having problems with offsets. Somehow the offset of fluxer, wave and preheat dont match one another or the program we create. The previous owners are of no help. The main question i have
Electronics Forum | Mon Apr 22 04:19:09 EDT 2013 | dilogic
Parameters->Miscellaneous I/O then select Inputs and scroll down to REAR_P2P_TOWER_DOWN, select appropriate input and change State field from 1 to 0, then press OK and save.
Electronics Forum | Tue Apr 05 02:30:11 EDT 2005 | Bored
Hi, I have seen in the past programs on GSMs using a pushdown function so that the selected previously placed component can be pushed once again into the paste by one of the nozzles. I have tried using greater pressure on the placement but need that
Electronics Forum | Tue May 03 10:58:56 EDT 2016 | ttheis
I'm not sure- I'll check that. The machine is running ups version 3.2.2c. Previously I just went into the order list and selected to move the component in the list, put it at the end before the repair step and added an end block step after the compon
