Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis
Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical
Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Mon Jun 08 10:45:25 EDT 1998 | Henry Hickey
How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pres
Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon
| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can
Electronics Forum | Fri Feb 09 13:05:14 EST 2007 | realchunks
Lawyer questions in the fact that they are silly or seem so vague? "1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow?" No, not by typical X-ray equipment designed for PCB manufacturing. "2. At 300 degree Ce
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
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