Electronics Forum | Thu Jun 08 18:19:40 EDT 2017 | edhare
Jeff, You might look at this paper, which has some background & references that are relevant to your question ... http://www.semlab.com/papers/diffusionbarrierplatinginelectronics.pdf Ed Hare
Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare
Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.
Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare
0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare
Electronics Forum | Tue May 21 16:18:57 EDT 2019 | edhare
Interesting problem. I've seen this before on SMT device leads (see Gold Embrittlement paper at http://www.semlab.com). The AuSn4 IMC is solid at typical reflow temperatures and traps volatiles in the solder joint. One usually cannot crank the ref
Electronics Forum | Thu May 23 15:29:57 EDT 2019 | toms
Sorry for switching accounts, the SMTA interface was not giving me the option to add attachments. Evtimor - IC testing of some samples of different assemble holes and components leads did not yield anything abnormal. SEM EDX of the unsoldered lea
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