Electronics Forum: edgebond (Page 1 of 1)

underfilling of bga

Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo

There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p

  1  

edgebond searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
ISVI High Resolution Fast Speed Industrial Cameras

World's Best Reflow Oven Customizable for Unique Applications
IPC Training & Certification - Blackfox

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Void Free Reflow Soldering

Component Placement 101 Training Course
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals