Electronics Forum: electrical clearance csp (Page 2 of 4)

solder splatter inspection

Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef

You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu

Electric Arching on Y-Cap using No Clean Flux

Electronics Forum | Wed Feb 01 04:29:37 EST 2006 | rlackey

That would be the lightning effect, with increased humidity reducing resistance. 1500 VDC or 1500 VAC? What is the distance between the edges of the pads - i.e. not the pitch of the component, but the actual physical distance between conductors? A

SMT electrolytic capacitor lead classification is???

Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks

Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

Flux Designations and Composition

Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef

You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Solder balls

Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef

IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00

FS: Electrovert 500CLV (10 Zones) IR Oven

Electronics Forum | Thu Feb 19 15:17:52 EST 1998 | Bipin Napal

Available immediately. Call Bipin at 416-385-0855 Make: Electrovert Model: 500 CLV Electrical: 440V, 3Phase, 60HZ Manufacturing Date: Dec 22, 1992, and upgraded in 1994 Physical Size: Length 205.5�, Width 55� Heating Zones : 10 Upper & 10 Lo

Help!: PBC Trace Failures at SMT pads!

Electronics Forum | Mon Aug 31 16:23:37 EDT 1998 | Bill Boles

We have an unusual problem here and I'm reaching for more input if anyone can help??? We are an OEM manufacturer of PCA's. After a history of consistent quality designs, we have one small memory SIMM that is causing major headaches for us and our PCB


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