Electronics Forum | Thu Dec 19 02:16:19 EST 2019 | sssamw
if use more aggressive paste,be careful risk of electro-chemical migration
Electronics Forum | Tue Oct 20 05:47:42 EDT 2020 | Mike Konrad
Most often, dull solder joints (post cleaning) is a result of the cleaning chemical. Most (not all) modern cleaning chemicals are equipped with corrosion inhibition agents which prevent dulling. Check with your chemical supplier to see if your specif
Electronics Forum | Wed Jan 31 09:16:26 EST 2018 | emeto
"...electro-chemical migration failures..." Come on Michael, You are totally selling it here.
Electronics Forum | Thu Feb 01 09:48:57 EST 2018 | davef
"...electro-chemical migration failures..." Come on Michael, You are totally selling it here.
Electronics Forum | Wed Nov 04 11:00:00 EST 2009 | tstrat
That is interesting, I have not seen that as a requirement before. From what I read if it is less than 7 wt% the corrosion resistance is pretty low, but if the value is too high it indicates that "black pad" is present from nickel corrosion. From wha
Electronics Forum | Fri Dec 07 15:17:06 EST 2001 | davef
Dull / shiny, I�m not sure that�s a proper indicator. If �Liquid Tin� adds a thin coat of solderable material without converting the corrosion on the surface of the lead, the corrosion will [probably] continue to increase and potentially affecting t
Electronics Forum | Thu Sep 11 16:14:59 EDT 2008 | adamcrum
Our DI system has a carbon cylinder and a mixed bed cylinder. This is from the Mfgr website: "The Technical Devices' Nu/Clean Recirculating Water Deionizing System is engineered to remove all organics, chemicals, and heavy metals via particle
Electronics Forum | Wed Feb 01 18:11:43 EST 2006 | Chris
I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vias have pin hole openings or even larger openings, chemicals from the ENIG process could become entrapped in the via holes and not washed away in the
Electronics Forum | Sat Jun 23 07:34:26 EDT 2007 | davef
This sounds like a form of corrosion called electromigration. It creates cathode anodic filaments. They have a fern like shape because it is a metallic based crystal structure. Electromigration requires: * Difference of electrical potential * Chemica
Electronics Forum | Mon May 24 16:34:03 EDT 2004 | Mark
I just got a report from MacDermid on Solder Mask Interface Attack Issue (SMIA) with Sterling Silver Process. Corrosive chemicals in the ImAg process get trapped under the soldermask edge and eat at the copper trace. They are experimenting with diffe
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