Electronics Forum | Thu Dec 19 02:16:19 EST 2019 | sssamw
if use more aggressive paste,be careful risk of electro-chemical migration
Electronics Forum | Wed Jan 31 09:16:26 EST 2018 | emeto
"...electro-chemical migration failures..." Come on Michael, You are totally selling it here.
Electronics Forum | Thu Feb 01 09:48:57 EST 2018 | davef
"...electro-chemical migration failures..." Come on Michael, You are totally selling it here.
Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous
This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Tue May 03 21:49:45 EDT 2005 | KEN
Tin wiskers Electro migration all in the same week! (just kill me now God)
Electronics Forum | Thu Feb 01 17:34:45 EST 2018 | Mike Konrad
Thanks for the kind words Dave. At no point in my reply was I trying to sell anything. I apologize to anyone who believes otherwise. I agree with the poster, if assemblies are going to be cleaned, consider a flux designed to be cleaned. While this is
Electronics Forum | Mon Dec 18 19:31:33 EST 2023 | kojotssss
Surely somewhere the cleaning or rinsing liquid gets to the other chamber. It is possible that the chemical migrates to the flush or flushes the chemical into the chamber. I have had a similar situation, high foam, injection vertical spray offline st
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Electronics Forum | Fri Aug 16 12:32:56 EDT 2019 | edhare
Steve, Yes, in my experience clients send in field failures (so latent failures) that exhibit internal shorts when a secondary fracture propagates from a knit line fracture. These eventually short due to electro-migration from plate-to-plate through
