Electronics Forum: electro plate circuity (Page 1 of 2)

Shelf life of electro-plated tin-lead on stainless steel

Electronics Forum | Fri Nov 07 15:57:56 EST 2003 | Marc Simmel

Are there specifications or recommendations for electro-deposited tin-lead plating thickness on austenitic stainless steel that would provide a shelf life of 1 year? 6 months? Would 2 to 3 microns (78 to 118 micro-inches) 90/10 tin-lead over 1.27 mi

RF BOARD + SOLDER PASTE TYPE PROBLEM

Electronics Forum | Mon Nov 05 19:37:32 EST 2007 | davef

You weren't specific about the frequency band were you're operating. So, let's pound a couple of stakes in the ground. * Conventional tin-lead plating of 200-300 �m is quite satisfactory for lower frequencies in the range of 2GHz. * At frequencies h

Shelf life of electro-plated tin-lead on stainless steel

Electronics Forum | Sat Nov 08 10:04:26 EST 2003 | severs

Once you have selected your plating based on electrical and physical requirments, you should know that there is an inexpensive plastic storage packaging developed by Lucent which can keep any platings solderability from degrading for up to 10 years o

Top 5 of No-clean Solder Paste

Electronics Forum | Fri Mar 04 10:04:14 EST 2005 | jbrower

We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stenci

Nodules in barrel plating

Electronics Forum | Mon Sep 11 14:07:26 EDT 2000 | Steve

Hi ya'll!! We've got some PCB's in receiving inspection that has these little nodules in plating inside all of the barrels. These are microwave PCB's and have almost all of the surface area on both sides covered with with solid metal planes, and no

soldering to thick gold plating

Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com

We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick

Cracked MLCC's

Electronics Forum | Fri Aug 16 12:32:56 EDT 2019 | edhare

Steve, Yes, in my experience clients send in field failures (so latent failures) that exhibit internal shorts when a secondary fracture propagates from a knit line fracture. These eventually short due to electro-migration from plate-to-plate through

Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa

We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing

Gold Surface Finish on PCB's

Electronics Forum | Thu Dec 08 01:05:34 EST 2005 | Mike_Kennedy

Our new PCB supplier can give us a 20% price reduction if we convert from an ENIG finish to a FLASH gold finish. My uderstanding between the two is as follows: ENIG - Nickel is plated over copper and then immersed in Gold which forms a self limited f

Gold Surface Finish on PCB's

Electronics Forum | Fri Dec 09 02:20:47 EST 2005 | Mike_Kennedy

Grant, I dont quite understand the implications my self yet on gold deposit using FLASH or ENIG. However the important part of the gold finish is that it is kept under 3% of the total solder joint, so normally its safe. With the FLASH process it is m

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