Electronics Forum: electroless nickel conductivity (Page 12 of 15)

Re: Plating Processes

Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon

| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

Pad and Stencil Design

Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake

A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef

ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in

Re: soldering to hard gold plated PCBs

Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.

| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect

Re: Specifying Pcb Format/Construction. Help!!

Electronics Forum | Tue Apr 27 05:04:50 EDT 1999 | Charles Stringer

| Hi Murray! | | Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. | | Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads.

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

imm. silver

Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef

Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in


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