Electronics Forum: electroless nickel conductivity (Page 5 of 15)

Black color solder wetting after reflow

Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday

This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in

ENEPIG

Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit

Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower

ENIG used with stainless-steel membrane switch

Electronics Forum | Thu Jul 24 13:12:41 EDT 2008 | dphilbrick

I seriously doubt it. It is extremely thin and the gold's only real purpose in life is protect the nickel underneath from oxidizing. Once you wear that very thin gold off you will have exposed, oxidized, nickel and loss of conductivity.

Nickel/Hard Gold thickness

Electronics Forum | Fri Feb 24 11:31:20 EST 2012 | pauld

I need to be sure of the Nickel/Hard Gold thickness to be specified on our drawing. We use hard gold on a slip ring pcb that has brushes riding over the conductive surface, so soldering is not the issue. I read through the hard gold vs immersion gold

Re: Gold boards OK with SMT? What About Gold Thickness? - Clarification

Electronics Forum | Wed Aug 12 07:22:52 EDT 1998 | Earl Moon

| | | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated,

electrically conductive adhesives

Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef

We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.

Re: Silver Thru' Hole

Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB

Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William

I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a

Electroless Nickel without gold immersion

Electronics Forum | Wed Aug 21 10:20:05 EDT 2002 | ksfacinelli

Dave, I am interested in a amine hydrochloride activated flux. Can you give suggestions on readily available fluxes that you have used that have strong deoxidization properties. I am looking at something that could be used in a pinch when the stan

Black Pad

Electronics Forum | Tue Jan 10 20:56:45 EST 2006 | davef

Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b343900f7010VgnVCM100000f932a8c0


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