Electronics Forum | Fri Nov 14 02:18:04 EST 2008 | act_smt
What is the spec or true classification for the leads for an Electrolytic capacitor? Is it a : 1)Flattened coined lead??? or 2)Flat Lug Lead??? There is some confusion as to how we should be inspecting & accepting the toe overhang on these per IP
Electronics Forum | Tue Nov 18 20:03:19 EST 2008 | davef
Here are people at IPC that can direct you to the people you need to talk to about the issues that you have with the standards: * Jack Crawford, IOM, IPC Director Certification and Assembly Technology, crawja@ipc.org 847-597-2893, 847-615-5693 * Dav
Electronics Forum | Wed Nov 19 02:30:30 EST 2008 | lococost
... or try the IPC technet http://listserv.ipc.org/scripts/wa.exe?A0=TechNet
Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks
Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c
Electronics Forum | Tue Nov 18 19:24:07 EST 2008 | act_smt
I'm just wanting something solid to show my workplace. I am under the belief that it is a flattened coined lead. But like how i've been trained in IPC, I have to be able to prove that it is true... or that IPC says it is false. We have a customer tha
Electronics Forum | Sat Jun 19 17:05:25 EDT 2010 | bob2000
Thanks for sharing your work experience. I found a reference material with IPC standard (IPC 610) that specifies an exact heigth that a capacitor needs to be placed, I will check this standard specifications in more depth.
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray
I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W
Electronics Forum | Tue Oct 11 22:54:49 EDT 2005 | KEN
Yes, let the nightmare begin. Most electrolytic caps will not meet the 260 minimum and many will not even make 250. These do not meet IPC J-std-020 standards for lead free soldering. I had one batch of LF boards go through with a spec. of "not
Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman
Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?
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