Electronics Forum | Fri Sep 08 16:09:42 EDT 2000 | Erv
We do one of two things here; 1. We have cut up a bar of solder to different lengths, wieghts, etc. and place them on top of the offendinding floater, or 2. On selective wave pallets we will build a jig/clamp to hold down the part.
Electronics Forum | Mon Sep 11 20:35:28 EDT 2000 | Dave F
Charlie: What takes longer? 1 Forming component leads to prevent lifting 2 Placing a bag of pellets on the board, waving the board, taking the bag off the board, straightening the components, returning the bag to the front of the wave, etc, etc Goo
Electronics Forum | Fri Sep 08 09:16:00 EDT 2000 | Robert
I just purchased an old Fuji FGL glue machine without manuals and would like to purchase a copy if anyone has them.
Electronics Forum | Thu Sep 07 13:31:37 EDT 2000 | Danny Carr
Vincent, Try some Robotics forums, a list of them can be found here: http://www.industrycommunity.com/ee/index.htm Good luck! Danny Carr
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Wed Sep 06 20:26:35 EDT 2000 | Greg
Hi, anybody there can help me figure out the degree of misalignment specially on RC components when they're inside the reflow oven? thanks
Electronics Forum | Wed Sep 06 21:50:09 EDT 2000 | Caroline Tang
I have two lines of great condition used Yamaha machine which is going to be on sales. Would you guys be interested?
Electronics Forum | Tue Sep 05 04:19:23 EDT 2000 | P.GERARDIN
We intend to promote the new PCB cleaning process with acqueous chemistry , but we face with an important demand : Do we have to dry the pcb after ? Wich is the treshold humidity content to avoid any risk for FR4 material ? Regards Pascal
