Electronics Forum | Wed Dec 05 18:22:14 EST 2001 | gbarrows
I assembly boards that have 200 each of the MICTOR connectors. The boards are .300" thick. I have 100% solder fill in the holes. I also have developed a rework process so I can remove and replace the connectors if the they get broken by my custome
Electronics Forum | Tue Jun 02 08:48:06 EDT 1998 | Mike Moninger
This occurs on only one, two, or three sides at random. But I'll bet that the "good" sides have the same problem ,it's just that the center pins of the array are centered and it gets progressively worse towards each end, just not bad enough to be r
Electronics Forum | Sun May 31 16:07:25 EDT 1998 | Alain De Bock
Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignmen
Electronics Forum | Sat May 30 11:25:51 EDT 1998 | S�rgio Luiz Vito
We are a company assembler of telephones and PABX equipaments from Brazil. At the moment, We ares preparing our process for the assembly of PCB with component SMD on both sides. We will appreciate a lot if somebody can contribute with suggestions or
Electronics Forum | Sun Jun 07 09:38:42 EDT 1998 | Bob Willis
If you mean solder beads at the side of chip components then download the FAQs and the process guide on solder beads which may be of interest. The documents are on my web site www.bobwillis.co.uk | We are getting solder balls after reflow of surface
Electronics Forum | Wed Jun 03 10:09:39 EDT 1998 | Robert Horowitz
My name is Robert Horowitz with Contact Systems. We meet all the specs. you defined including Bar Code reading of both boards and components. Please call me at (203) 743-3837 for more information. Regards, Robert Horowitz Sales Manager Contact Syste
Electronics Forum | Mon Jun 01 19:04:45 EDT 1998 | Chris
I run about forty different boards ranging from single to double sided & from 0603 to 324 PBGA. 2> The placement rate is around your spec. 3> And depending on the table arrangement you can get up to & above your feeder needs including several soic vi
Electronics Forum | Thu May 28 08:39:13 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 28 08:38:43 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 28 01:48:16 EDT 1998 | Roni Haviv
Hello, I need some users information about "hot air knife" after the wave bath: - Defects reduction ? - In what kind of boards(TH/SMT SOICS ect.) it is applied ? - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ?
