Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
Electronics Forum | Mon May 11 16:09:07 EDT 1998 | Todd N
We are having continuous bridging problems with the trailing leads on a 26-pin D-sub through-hole connector. The pitch is 0.100". The connector is going through the wave at approximately a 20 Degree angle. Does anyone have any board layout recommend
Electronics Forum | Sun May 10 02:38:15 EDT 1998 | Bob Willis
I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hope
Electronics Forum | Tue May 19 14:59:51 EDT 1998 | Dave F
| I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hop
Electronics Forum | Sat May 09 13:49:03 EDT 1998 | EFData
Awhile back, I remember seeing some postings regarding solderability of Alloy 42; unfortunately, at that time, it wasn't a concern of mine but it is now. There was a gentleman from TI who seemed to do some extensive research into the matter; do any o
Electronics Forum | Fri May 08 16:33:46 EDT 1998 | Chrys
| As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | Any advice is appreciated. | Greg Sounds scary, particularly from a reliability
Electronics Forum | Thu May 07 18:30:38 EDT 1998 | Peter
We just purchased Mitron/GR Software's CB97. We have Universal's 4790 and Contact's 3AV machines. Both these machines part libraries are in binary format and their respective software packages cannot export out into ASCII. Has anyone out there discov
Electronics Forum | Thu May 07 22:13:10 EDT 1998 | Wayne
| Sorry for the confusion. For now there is but one | forum, and that is this SMT Forum. Everyone is | welcome to post any technical issues related to | pcb design, fabrication, and assembly, of which | capital equipment is an integral part. Cunli
Electronics Forum | Wed May 13 06:30:44 EDT 1998 | Wayne
| | Me thinks Wayne and Pete must be salesman! Duke: As for me you're right, but I think we are all salesmen and are selling ourselves everyday. Some of us better than others! Spent my twenty years in manufacturing before becoming a representative.
Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette
80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder
