Electronics Forum: electron (Page 5953 of 7904)

Baking components at 70 degree

Electronics Forum | Thu Dec 20 10:23:12 EST 2007 | slthomas

You could have said "why don't you just flop 'em over twice into the right tray?" lol. Yeah, that's the right way. I was kind of focused on what I had to do here to get two different parts from full trays into two cut-in-half-the-long-way trays sinc

Baking components at 70 degree

Electronics Forum | Sun Jan 06 22:36:08 EST 2008 | mac88

My recommendation is that you send all your question to Mumtaz Y. Bora, Sr. Staff Component Engineer from Kyocera Wireless (mbora@kyocera-wireless.com). She is also a member of the committee that is writing the new specifications for Moisture Sensit

Baking components at 70 degree

Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech

Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra

Baking components at 70 degree

Electronics Forum | Wed Jun 25 12:48:51 EDT 2008 | sleech

I would love to see the documentation of the experiment that indicated that a 24-hour/70 degree C bakeiing cycle at 10Pa is more effetive than a 24-hour 125 deg C baking cycle at normal atmosphere. We have looked at the old Levey-Perlmann paper and f

Baking components at 70 degree

Electronics Forum | Sat Jun 28 13:53:07 EDT 2008 | sleech

Fowler: Thank you for your documentation. Your finding roughly coincide with our own. We also found that 70 degree baking removes 50%/60% of the ingested moisture from moisture conditioned MSD packages We ran an additional experiment that compared

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Thu Dec 20 07:50:12 EST 2007 | realchunks

Good to know there are a few smart people left in this industry like Darby. I love how everyone assumes the original poster was only talking solder paste. We use screen printers for five different materials. Some of which we triple print by design

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Thu Dec 20 08:00:50 EST 2007 | avalancher

Many years ago, we used to double print. The way we did it was with a rubber squeegee set to do a flood stroke, followed by a return cleaning stroke with a metal squeegee. Why?! Well, this was in the days before Laser etch, and because the chem bat

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Thu Dec 20 10:15:09 EST 2007 | slthomas

Wow, Chunks, condescension becomes you. Not. I think that in this forum when someone mentions *stencil* printing and doesn't specify what material, we tend to gravitate towards a scenario that involves printing solder paste first, then adhesive. If

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Thu Dec 20 12:05:46 EST 2007 | realchunks

Not you Steven. Blanket comments like "Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades." are so way off base.

Silkscreen/Legend on Pad

Electronics Forum | Wed Dec 19 22:48:40 EST 2007 | davef

Naw, your legend is cured epoxy that's not going anywhere. There's no magic solution that will correct the mess you've made [found yourself in]. Use a sharp xacto-like knife to scape the legend off. People should have noticed and corrected this bef


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