Electronics Forum | Tue Jul 31 10:10:45 EDT 2007 | patrickbruneel
AJ The metal prices are set by the London LME. The Tin prices went from 8,000 US$/tonne July 2006 to 16,000 US$/tonne July 2007. Check here http://www.lme.co.uk/tin_graphs.asp Just change the dates to get the price differences over time, the furth
Electronics Forum | Tue Jul 31 22:06:12 EDT 2007 | davef
We had no problems reflowing an assembly on Bergquist Thermal Clad. The assembly was small. So, we built it on a 8-up fixture. It stayed in the fixture from screen print, through pick and place, and into reflow. When the fixture came out of the r
Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110
I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with
Electronics Forum | Thu Aug 09 15:54:12 EDT 2007 | jimmyjames
We have the same problem at times but our feeders tend to move to the back when we want them on the front. We have Opal machines but all the software should be the same. (assuming you have the offline programming/optimization software, AMS) What yo
Electronics Forum | Thu Aug 16 17:16:14 EDT 2007 | wayne123
put the tubed parts on the side of the machine that is desired and then when optomizing in the condition portion set it to "feeders move within table" simply setting it to feeders move will result in the parts moving from front to rear and visa versa
Electronics Forum | Wed Aug 08 17:05:01 EDT 2007 | klaughton
I have instituted a policy that probably seems a little extreme to some, but is worth the cost in my eyes. Once a jar of solder paste is opened, it must be thrown away at the end of the work day (Properly discarded, of course). We use the small 250
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Sat Aug 11 15:59:10 EDT 2007 | bentigano
Hello cuculi. I was actually the guy you sent the .pl file to a while back to help me out with the .800 program optimization. Speaking of which, the Perl code reminded me a lot of PHP, and was extremely helpful, so thanks again. Hopefully I'll be ab
