Electronics Forum | Thu Jul 17 15:23:23 EDT 2003 | James
It is really hard to tell what it is. It just looks like parts of the pad did not solder and you can see where the solder would even go around the pad leaving voids.
Electronics Forum | Fri Jul 18 11:05:07 EDT 2003 | davef
A highly activated flux will begin to corrode the imm tin coating after 10 minutes. Corroded tin has poor solderability.
Electronics Forum | Thu Jul 17 15:24:50 EDT 2003 | James
COULD ANYONE TELL ME WHERE TO BUY ALUMINUM TAPE USED FOR PROFILING? THANKS FOR YOU INPUT.
Electronics Forum | Thu Jul 17 15:52:47 EDT 2003 | davef
Aluminum tape suppliers: * Chomerics Inc (T405 aluminum tape) 77 Dragon Ct # A Woburn, MA 01801 (781) 935-4850 * CS Hyde Company 800-461-4161 / 847-265-6903 Fax: 800-441-8063
Electronics Forum | Tue Jul 29 21:21:41 EDT 2003 | Dean
KIC Thermal Profiling also sells the double - sided aluminum tape. They also did a white paper characterizing the material... Good stuff.
Electronics Forum | Thu Jul 17 17:53:38 EDT 2003 | Jim
I would respectfully tell them to kiss off and go do their own damn analysis. Or something on a lighter note so as to preserve the customer's business.
Electronics Forum | Thu Jul 17 18:49:31 EDT 2003 | slthomas
So you wouldn't verify with something other than your own visual (magnified to whatever you have on hand at your facility) inspection that you could use the process without damaging the product?
Electronics Forum | Fri Jul 18 09:19:33 EDT 2003 | caldon
http://www.smtinfocus.com/dictionary.html The link above is a good source for a dictionary. good Luck Cal www.ctdi.com
Electronics Forum | Fri Jul 18 15:04:44 EDT 2003 | pjc
Top Four Dispensing Equipment Companies: Camalot www.cooksonee.com/about/about_camalot.html Asymtek www.asymtek.com GPD www.gpd-global.com Creative Automation www.cacsystems.com All above cos. have applications engineering personnel for underfil
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
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