Electronics Forum | Mon Dec 02 09:47:54 EST 2002 | davef
Most modern spec do not distinguish between process methods. So, there is no allowance "if you are using bla bla bla method, you should see ... . But if you are using bla bla de bla method, ignore that and look for ... ." Most specifications requi
Electronics Forum | Fri Nov 22 10:18:33 EST 2002 | Joaquin Rodenas
Dear Mr. Liang I'm a service ingeneer in a distributor of FUJI products. My first suggestion is get some help from the FUJI dealer in your territory, but anyway try the following: First of all, check again the FTP tool included in F4G-main windows
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Thu Nov 28 09:51:37 EST 2002 | davef
I got here before the experts did. Underwriters Laboratory Incorporated is an organization located in the United States and is purely concerned with product safety performance. UL operates laboratories for the investigation of materials, products,
Electronics Forum | Tue Dec 03 07:57:27 EST 2002 | pjc
Price of DEK 248 and MPM UP100 are about the same, $22-36K range. MPM UP100 has programmable squeegee pressure. Precise, repeatable results with less operator involvement. Pressure parameters saved in board program file. DEK 248 has manual microm
Electronics Forum | Tue Dec 03 13:35:22 EST 2002 | wpease
Hi Brad, Before I tell you my glove fits your hand, I'd like to see your hand. More specifically I'd like to learn more about your application. Board size range? Component size range? Finest pitch? Degree of warpage? Two-sided? etc. Contact m
Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas
We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav
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