Electronics Forum: electronics (Page 1332 of 7927)

Wavesoldering

Electronics Forum | Thu Mar 15 07:49:44 EST 2001 | jax

I am not sure if it is feasible in your situation becuase I don't know enough about your board ( mixed technology, single-sided, etc.... ) , but have you ever considered screen printing paste onto the test points?? JAX

Wavesoldering

Electronics Forum | Thu Mar 15 17:28:44 EST 2001 | rentreo

Sounds like a problem I ran into recently. In my case it was a problem with via holes which were used as test points on our in-circuit tester. My problem was caused by moisture in the boards. My cure was a 24 hour bake at 100 deg c.

Need Expert Support

Electronics Forum | Tue Mar 13 18:52:21 EST 2001 | jax

Are the boards in question immersion gold? This could be a process problem at the board shop. If this subcontractor has done good work for you in the past it might be an outside variable causing the problem.

Need Expert Support

Electronics Forum | Wed Mar 14 10:02:36 EST 2001 | blair

Boards were not immersion gold. They were HASL but I would like to change. What is the prefered surface fininsh for BGA and fine pitch stuff these days? I am starting to ask for Gold/Nickel on FAB Dwgs due to PCB house and assy house discussions.

Attaching a Cost to Solder Defects

Electronics Forum | Wed Mar 14 17:26:03 EST 2001 | davef

Most $$-value stuff is dependant on the cost structure of the company. Why not do a small cost study to measure the amount of time your improvements save? Folk in accounting should be able to "rough price" the $$ benefit of your efforts.

Bottom side process question

Electronics Forum | Thu Mar 15 11:12:45 EST 2001 | slthomas

solder, but flux -> adhesive. Hmmmmm.... Are the chemists working hard to reduce the consequences of these possibilities? And as to Dave's comment about long term reliability issues due to outgassing from the adhesive, double-hmmmmmmm....... Ther

Bottom side process question

Electronics Forum | Thu Mar 15 11:18:12 EST 2001 | slthomas

That makes us almost even, Dave. I have a hard time believing half of what you say. ;)

Bottom side process question

Electronics Forum | Thu Mar 15 21:02:20 EST 2001 | davef

Wazis havin' "a hard time believing half of what you say"? I demand a least 90% from peeps!!!

Bottom side process question

Electronics Forum | Fri Mar 16 13:50:16 EST 2001 | mparker

Shadowing sounds about right to me also. Really dicey experiment to run if you are dropping expensive tantalums just to save a little coin in epoxy and processing time.

Bottom side process question

Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman

We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.


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