Electronics Forum | Mon Apr 30 10:09:19 EDT 2001 | davef
http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1363&mc=7
Electronics Forum | Tue May 01 07:54:10 EDT 2001 | bdoyle
We have been experiencing some problems with the email system but have been, and will continue to work on it. I would recommend that the associate resend the email for now. We appologize for any inconvenience this might cause. -Brian
Electronics Forum | Tue May 01 20:18:37 EDT 2001 | jwdyer
I have a PTF that is blowing the MMIT card on the PTF. Anyone have any ideas why? It's OK until the PTF begins the zero process. Thanks, Dyer
Electronics Forum | Wed May 02 11:20:29 EDT 2001 | chugarth
Can anyone out there tell me where I might find some application support for a 2275 Genrad. I am in desperate need of someone to show us how to basiclly startup this tester. I am located in the Lower Rio Grande Valley of Texas. Any Information would
Electronics Forum | Wed Dec 20 14:27:28 EST 2000 | trgroth
I am unable to find a reliable source to determine the amount of package damage allowable on an SMT coil inductor with a ceramic case. Where can I find information of this nature.
Electronics Forum | Wed Dec 20 14:09:33 EST 2000 | OS
What are the step or critical area that one should check when qualifying PCB first article from a new manufacturer.
Electronics Forum | Mon Dec 18 18:14:20 EST 2000 | Dave F
In older resin materials used in printed circuit board fabrication, there seemed to be a direct relationship between CTE and Tg. Now with more modern resins that reationship no longer appears clear. Please comment.
Electronics Forum | Mon Dec 18 18:08:41 EST 2000 | Dave F
What are the issues with fabricating multilayer PTFE boards? Are these compare with the issues of throught holes and vias in PTFE boards? If not what are these issues?
Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper
The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when
Electronics Forum | Wed Dec 20 10:17:10 EST 2000 | markt
What steps are presently being taken by manufacturers to deal with problems such as layer bond strength, cold flow, and dimensial creep at present? Are there substantial materials research efforts, that you are aware of, in progress that address thes
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