Electronics Forum | Wed Oct 25 16:54:43 EDT 2000 | Medhat Enab
How can country like Egypt devolpement Products that using SMT component and the big market like China are compete and kill this kind of devolpment in the small market by the price wepone? N.B.:We have almost 10 SMT production line, I was responsibl
Electronics Forum | Wed Sep 20 10:38:51 EDT 2000 | Dave F
When an operator using your machine damages a board during rework, how does that damage and the repair required compare with a hot system?
Electronics Forum | Mon Sep 18 20:24:25 EDT 2000 | Dave F
What are the non-recurring operating costs of running this machine? How long does it take to program a rework operation, assuming you have CircuitCAM or something like that?
Electronics Forum | Thu Sep 21 08:23:52 EDT 2000 | Erick Russell
The temperature is measured with a Pyrometer. It measures the spot that is being heated with the laser. As the surface heats up, the laser power is decreased to stabilize the temperature.
Electronics Forum | Thu Sep 21 09:45:42 EDT 2000 | Erick Russell
The pyrometer is a non-contact temperature measuring device. It optically measures the surface temperature of the component surface every 10ms.
Electronics Forum | Tue Sep 19 13:39:36 EDT 2000 | Dave F
No nozzles!!! Cool!!! We buy nozzles, like jelly beans. In a low volume, high mix shop how does the total cost of ownership match-up with a high-end air rework station?
Electronics Forum | Mon Sep 18 11:29:21 EDT 2000 | aflewelling
Why would I want to use photonic soldering for my rework applications?
Electronics Forum | Mon Sep 18 17:55:55 EDT 2000 | Dave F
Reworking BGA with hot air systems (ie, AirVac, SRT) is fairly complicated and requires fairly rigorous process control. Please compare and contrast BGA rework using hot air and your laser based system.
Electronics Forum | Thu Aug 24 15:35:55 EDT 2000 | jkervin
Hi Dr. Lee, Besides the requirement of a PB free surface finish on PCBs, could you tell me what the pros and cons of a Bismuth bearing solder are? Thanks, Jon Kervin
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
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