Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Mon Jun 14 10:44:28 EDT 2004 | davef
Look here: http://www.arenasolutions.com/google/bill_of_materials.html We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Thu Jun 17 01:59:35 EDT 2004 | ntcic
We can assist your company in procuring the iems on the BOM. We are a large stocking disti based in the USA. Please contact me so we can be included to give you competitive pricing..Let us do the work for you. Thanks..Chris J
Electronics Forum | Mon Jun 14 16:49:08 EDT 2004 | Dreamsniper
Can I manually tin them with solder specially the BGA's. Will that improve the solderability? What about corrosion of the copper? will it be prevented with the above process considering that after tinning of solder the solderability became acceptable
Electronics Forum | Mon Jun 14 22:49:46 EDT 2004 | Ken
Um...I would reject those boards. skip plating is a process indicator...a bad indicator. IF your building to class 3...I would get the rep in ASAP and reject the lot.
Electronics Forum | Mon Jun 14 11:57:59 EDT 2004 | azdback
We are in the process of evaluating the Circuit Cam software for the creation of pick and place programs and Visual aids for QC. So I would like to hear from actual users that can give me some feedback on the pros and cons of this product. Thanks in
Electronics Forum | Sat Jun 19 05:56:45 EDT 2004 | wurzlseppl
By Universal programming system I mean the UCT 50 software! I would be very grateful if someone could offer me a solution for my problem!
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Tue Jun 15 08:22:39 EDT 2004 | jsmith01
The parts are dated Mar 20 2004. My profile hits a peek of around 232-240c and is above 225 for around 30 seconds.
Electronics Forum | Tue Jun 15 11:08:02 EDT 2004 | russ
Well take away the easy answers! How are the parts falling off? Is the joint breaking the termination on the part or is it breaking at the solder to termination interface? Also, how long are these parts in liquidous state? and what type of paste a
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