Electronics Forum | Fri Jul 09 20:39:31 EDT 2010 | malcolmlanders
I have never placed a bga chip before and need to know some o0f the basics of how to do it. I am really intrested in how the stencil will work with the soider and if there is a special soider that i need to use. I usually use a leaded soider from man
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Tue Jul 13 05:21:04 EDT 2010 | bubbobbed
Guys, I've received complaints from customer that the chip is sticking on the cover tape or carrier tape when detape. Is there any possible that i can solve the problem by changing the cover tape or carrier tape?? some say the root cause of this issu
Electronics Forum | Wed Jul 14 12:33:54 EDT 2010 | vetteboy86
This has come up in the past, but I am ready to find an answer. A collegue immediately chalked it up to overheating the components. A check of that found otherwise. Not to mention it isn't all of them. For instance all the 104's 514's and 224's have
Electronics Forum | Tue Jul 20 14:58:01 EDT 2010 | vetteboy86
So, tell us more ... * Is this at in-bound > inspection? Where do you observe this? * Does > this affect the whole component, just > terminations, ... * Could the 'brownish' be > interpreted to be 'purplish'? * How wide-spread > is this [eg, mu
Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Thu Jul 15 13:27:42 EDT 2010 | xps
Thanks... anyway I confirm, the nickel disappear (verified by cross section)and a strange substance greyish above gold, covering the tabs after test. I don't know the reason for this phenomenon. I don't believe that with proper electrolytic nickel fi
Electronics Forum | Fri Jul 16 08:14:15 EDT 2010 | vetteboy86
We're expereincing issues in our pick and place machine due to what I consider a server warping of the PCB. The PCB is received this way from our PCB manufacturer. Before I push to much, I would like to know options for a cause. The warp is so bad,
Electronics Forum | Wed Jul 21 12:19:01 EDT 2010 | mb_mfg
To eliminate warping during processing, we have provided customers with composite fixtures to support the board on all 4 edges, with retractable pull down claps that can be added to the top of the PCB after the screen printing. Simply by pushing the
Electronics Forum | Wed Jul 28 08:47:08 EDT 2010 | vetteboy86
by viewing your posting i came to know this is > solder ability issue which is because of > marginable solder ability of PCB / > components, > > just ensure that issue due to > PCB or component . check the msl of of substrate > / component. v
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