Electronics Forum: electronics (Page 5280 of 7902)

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss

I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul

Line tech in need of help

Electronics Forum | Thu Mar 01 09:14:06 EST 2001 | Dale Dolan

Dek 265 Get yourself Formflex tooling for quick changeover time. The principle being tooling pins are raised by a combination of pneumatic's and hydraulics to meet the underside of the pcb which rises to print height. No longer will u have to judge

Line tech in need of help

Electronics Forum | Thu Mar 15 16:41:46 EST 2001 | jollyrodger

You guys are absolutely correct, and i thank you for your invaluable advice. I would like to know if there is any online manuals for the equipment i stated b4. I have tried so hard to find these with little results. However i did get onto th

Line tech in need of help

Electronics Forum | Sun Mar 18 09:21:20 EST 2001 | Billy

There is a Fuji web site that you could use. But perversely they send you your login. This takes about 3 weeks to arrive usually... in my case it took 2 months. FCM's i find to be quite inflexable... If your doing high volume put it on them anything

Epoxy crack causing intermittent failure

Electronics Forum | Thu Feb 22 13:11:51 EST 2001 | keithtbe

Silver epoxy is used to joint the LED beam lead and the trace of the flexi circuit. Due to the LED mounted skew upward or downward unconsistently, the strength of the joint weakened and causing the LED lights up intermittently. I would like to ask fo

BGA Solder Mask Repair

Electronics Forum | Wed Feb 28 09:53:17 EST 2001 | fkurisu

Hello Dave, Solder mask rework has been performed on both bare and populated boards. There are factors that come into play with a populated board that make this type of rework more difficult, such as the density of components(especially around th

solder stain on gold finguers

Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre

I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th

Round Solder Lands

Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC

Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac

Contamination of components

Electronics Forum | Tue Feb 27 10:29:48 EST 2001 | davef

Bud: Theoretically, I agree with you in-bound parts should meet your solderability requirements. Unforunately in real life, it aint gunna work, because if your buyer can't get you parts now, well 'cept the crusty ones that you're seeing, can you im

Selective soldering pallets

Electronics Forum | Mon Feb 26 14:15:21 EST 2001 | marting

Steve, Currently we are using selective pallets and the best piece of advice is to find a supplier that will be able to handle the requirements of the selective wave process, for example proximity of chips to PIH devices, and pallet thickness etc. We


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