Electronics Forum | Fri Jul 27 13:16:03 EDT 2001 | cjrjmj
I am looking at the Pump application for several bottom side applications we have. They are heavy in through hole radial and dip content. The initial testing of the stencil was very good, but I am concerned with inspection of the glue. We do a sampli
Electronics Forum | Fri Jul 27 21:17:10 EDT 2001 | Mike Kennedy
We are looking at another pick&place machine for our production line and are leaning towards the Juki2000 series and the YamahaYV series machines. I would like any feedback from those in the industry who have used either of these machines. Also we cu
Electronics Forum | Sat Aug 04 17:46:22 EDT 2001 | Marshall
The YV100X is Phillips TopazX in the U.S. while the YV88 is the Emerald. Now, We find the Juki's 2020 and 2030 more superior than Yamaha's or Philip's because of their flexibility in component handling and the standard features that come with the Juk
Electronics Forum | Sat Jul 28 03:05:35 EDT 2001 | Frank
Hi guy Does anyone have experiance with printing problem between solder paste water soluble 62/36/2 and gold plating PCB? I do have problem about insufficient solder after printing although I used the same printing parameter as when I print with ano
Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
Electronics Forum | Mon Jul 30 21:12:32 EDT 2001 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, a 6 thou stencil should be OK, providing you don�t violate the area and aspect ratios in the fi
Electronics Forum | Tue Jul 31 00:48:55 EDT 2001 | Frank
Sorry I forgot to provide enough information. Stencil thickness is 6 mil Aperture width is 10 mil Aspect ratio (aperture area / wall area) = 0.72 Solder paste mesh size, type 3 (-325 +500) With this aspect ratio we can printing without any probl
Electronics Forum | Sun Jul 29 09:17:20 EDT 2001 | davef
Tough to say, but ... Chlorine: Many fluxes contain chlorine. Sulphur: Many solders and paper packing materials contain sulphur. Sodium: No idea. IPC-J-001 talks to board cleanliness and specifies criteria according to the cleanliness test met
Electronics Forum | Sun Jul 29 21:33:30 EDT 2001 | CAL
Your Ionograph and Zero-ion Values are set by you. There is no raw pass of fail criteria only the limits you set up. Ionograph is great for bare board resistivity (salt) test just as a pass fail for incoming inspection but this is all per your facto
Electronics Forum | Mon Jul 30 09:31:46 EDT 2001 | kennyhktan
Dear All, I'm now facing with 0805's component missing problem at the production after mounting. In able to containing the defect I'm been trying to increase the soldering strength by changing the stencil thickness from 6mil to 8 mil on a step do
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