Electronics Forum | Sat Sep 04 06:37:46 EDT 1999 | JC Leigh
Dear all, I don't know if I'm asking at the right place here, since you all seem to be more focused on process problems then programming problems (or perhaps programming isn't a problem for you). I'm using FUJI CP642's and I've got some components
Electronics Forum | Sat Sep 04 06:01:49 EDT 1999 | Earl Moon
| Dear sirs, | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | Best regards, | | Jame Bond | | James, Stir, don't shake is not good advice for cleaning proflo heads. This thing works great, bu
Electronics Forum | Sat Sep 04 07:11:34 EDT 1999 | JohnW
| | Dear sirs, | | | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | | | Best regards, | | | | Jame Bond | | | | | James, | | Stir, don't shake is not good advice for cleaning proflo heads. Th
Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Thu Sep 02 10:35:46 EDT 1999 | Gian.D
We are assembling double side pcs reflowing (smt) on top and by wave on bottom. After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. After wave soldering we f
Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Thu Sep 02 12:27:54 EDT 1999 | stefano bolleri
You use MCS computers to transmit programs/data to machines --> MCSs are getting old, so you would like to use F4G or FujiCam just because you could use a standard 486/Pentium --> But you still like your current programming SW (obviously not MCS/F4G/
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
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