Electronics Forum: electronics (Page 7305 of 7901)

Re: pallet design for thin pcb's

Electronics Forum | Thu Sep 23 17:31:12 EDT 1999 | DaveH

For another excellent vendor try EMC GlobalTechnologies in Pennsylvania (215)340-0650. Contact Marty Wetzel. | | | | | | any thoughs? | | | | | | thanks | | | | | | | | You should use pallets that stand the reflow as well so that no separation wi

Re: Wrong Part on Siemens

Electronics Forum | Wed Sep 22 22:21:31 EDT 1999 | JAX

| Hi All, | | We have 19 Siemens machine running here and lately I was assigned to come out with a proposal on the wrong part issue on Siemens Machines. All of our machines are equip with siemens part verification in which there the part barcode is

Re: Thickness of layers en MLCC ?

Electronics Forum | Wed Sep 22 22:13:51 EDT 1999 | Dave F

| Dear all, | | First, I'd like to thank every one of you who have been a great help for my last questions. | | Then, I have heard that in multilayer ceramic capacitors, each layer of ceramic was about 3 micrometers at least. When adding the layer

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 17:49:50 EDT 1999 | John Thorup

| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 17:56:59 EDT 1999 | John Thorup

| | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | | Tha

Re: Metal Inspection Templates

Electronics Forum | Wed Sep 22 17:21:45 EDT 1999 | Hugh Martin

| | | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | |

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 08:49:59 EDT 1999 | Chad Notebaert

| | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | thanks | | | We use 6 mil lasercut stencils with 15% redu

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F

| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.


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