Electronics Forum | Mon Jan 03 11:33:15 EST 2000 | Zaklas, Yosef
Dear Sirs: We use BGA ceramic components in our assemblies. We would like to know if there is a technical problem of SMT assembly and reflow of these components on aramid surfaces. Yours immediate reply would be appreciated.
Electronics Forum | Thu Sep 10 12:32:31 EDT 1998 | Tim Scully
Heeeelllllp. I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting into su
Electronics Forum | Fri Sep 11 09:30:30 EDT 1998 | Earl Moon
| Heeeelllllp. | I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting int
Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park
Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Mon Dec 08 11:52:30 EST 1997 | j martin
part of my job function is to id all component requirements for our company. quite often i run into smt components that have mfr codes and not actual component part numbers. does anyone out there know of a way to id these parts.
Electronics Forum | Mon Dec 22 02:47:53 EST 1997 | jerdog
what you can do is call the manufacture and get a discription. | part of my job function is to id all component requirements | for our company. quite often i run into smt components | that have mfr codes and not actual component part numbers. | does
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
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