Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1
Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower
Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
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