Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
Electronics Forum | Fri Aug 18 13:38:09 EDT 2000 | James
I've heard there might be some problems when using an enclosed print head with water soluble paste. It dries out and compacts in the head. Just the opposite of what is claimed I know, but I hear it is wonderful when using no clean paste. Can anyon
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
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