Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie
I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Fri Sep 13 06:18:55 EDT 2002 | yngwie
Here's a long survey....Pls help. 1) What is the general feel for via in pad for upcoming designs? - complete Via in pad - partial encroachment - via partially in pad 2) What are the manufacturing bare PCB's related concerns, issues and possible dr
Electronics Forum | Mon Dec 21 09:53:12 EST 2015 | proceng1
What part do you think is a defect? You can see by the board that the two leads are electrically connected anyway. If you mean that the outside fillet on the right is shorter, just look at the board. It looks like you have solder mask encroaching
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Mon Aug 11 21:49:37 EDT 2014 | cmchoue
You mean that is void size or area can't cover via hole?
Electronics Forum | Mon Aug 18 14:38:51 EDT 2008 | floydf
Real Chunks, Does "aperture opening 100% same size as the via" mean, aperature the same size as the hole, or the barrel of the via. If that makes any sense. Thanks
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
