Electronics Forum | Sun Apr 13 17:02:24 EDT 2003 | MA/NY DDave
Hi In addition to DaveyF, I probably have this, yet let me give you a few places fast and you will probably find what you want from his, mine or the linkages. If not write again either way. http://www.edtn.com/ http://www.techonline.com/ http://ww
Electronics Forum | Wed Apr 09 12:18:37 EDT 2003 | MA/NY DDave
Hi This is an excellent question or research project. I would call the IPC and find out if anyone has already done this work. My guess is that Class III should be slightly better, yet considering the application difference where Class III is used
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
Electronics Forum | Thu Apr 10 10:54:34 EDT 2003 | pjc
It will vary by placement machine mfg. and type. I had 4x Fuji CP3 (turret chip-shooter) and 2x Fuji IP2 (split axis general app-fine-pitch)and tracked component shrinkage at 0.05%-0.5% on average. Above 0.5% triggered maint. & process eng. response.
Electronics Forum | Sat Apr 12 00:56:31 EDT 2003 | MA/NY DDave
Hi Well I will give you one of many. It just happened in my life that I worked there for decades a decade ago. Old IBM, now Endicott Interconnect Technologies (EIT) If your PWB is complex and you like support they hopefully will do a good job. If
Electronics Forum | Wed Apr 23 19:24:29 EDT 2003 | MA/NY DDave
Hi Grant, You already have a few good answers. If you have but one to a few BNC connectors I would kind of use the advice here or do what you already are doing aka hand soldering. I would not install a Wave Solder line for a really low volume of BN
Electronics Forum | Mon Jul 21 16:06:02 EDT 2003 | davef
We doubt that stain gages will provide the granularity or repeatability to provide meaningful data. Contact: Cemal Basaran, Dr Associate Professor SUNY Buffalo Work: 716-645-2114 X2429 Fax: 716-645-3773 E-Mail: cjb@eng.buffalo.edu 243 Ketler Hal
Electronics Forum | Wed Apr 26 07:49:49 EDT 2006 | jemills
No problems with ver 2.2 that I'm aware of. I'm in process eng. and part of my job is review the machine's capabilities. From what i read, Ver 2.3 & 2.4 software was designed to speed up setups and changeovers.I understand the auto teach functions is
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Electronics Forum | Wed Mar 28 08:45:03 EDT 2007 | pjc
I have seen point-to-point soldering iron tip robots in action at a number of factories. The problem is repeatability at delivering good solder joints. Consider a small selective solder machine, the nozzle type: www.ace-protech.com www.air-vac-eng.c
