Electronics Forum | Thu Mar 27 14:38:44 EST 2003 | MA/NY DDave
Hi kenlchin, Yes, This all helps with these little components that can be affected by the forces created during soldering more so, than their own stabilizing weight. On this tread which started with a composition only proposition, we have seen tha
Electronics Forum | Fri Mar 28 22:01:00 EST 2003 | MA/NY DDave
Hi Yes I agree, yet this subject is about Tombstoning and oven profile or even oven working correctly across the entire product is a sub-set of how one gets those little chip babies to sit and stay where they belong. Flat and Heeling like their mast
Electronics Forum | Wed Mar 12 09:23:56 EST 2003 | MA/NY DDave
Hi I don't see in your note any particular reasons why you couldn't. If it solders well and passes what ever specifications you are using than everything is OK. If your repair faces some soldering or rework challenges where a more agressive flux is
Electronics Forum | Thu Mar 20 14:17:39 EST 2003 | MA/NY DDave
Hi I don't think I will enter this too much except for one of your questions. YES multiple reflows affect reliability. Heck most everything affects reliability. Aggressive Heat cycles or Heat always affects the final MTBF reliability number. The
Electronics Forum | Tue Mar 25 11:23:25 EST 2003 | MA/NY DDave
Hi Benny, Move on over to some other forum like EDN or EETimes and piles more to post your question. Your luck will be vastly improved. This forum is not the best for electronic design issues like you are asking. YiENG, MA/NY DDave
Electronics Forum | Fri Mar 28 21:31:03 EST 2003 | MA/NY DDave
Hi Have you noticed with 3D scan technology a flatter and more filled top with the Rheometric when printing the smallest of aperatures. The Applications guys from the 3D companies told me they did see flatter tops. Granted this has to come also with
Electronics Forum | Fri Mar 28 21:37:11 EST 2003 | MA/NY DDave
Hi Are all the other solder joints for the other components other than the MELF not having a problem. That is what you said, yet I wanted to check?? To say a less twisted way is this only with the MELFs and is it with all the MELFs?? If you have
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Fri Mar 28 21:43:57 EST 2003 | MA/NY DDave
Hi Yes to your stone question. This pretty much goes with any flux change. Yes to the proper solvent for the flux you choose. Check with the Kester Data Sheets. Kester should have some application sheets which include some No-Clean information.
Electronics Forum | Fri Mar 28 21:54:54 EST 2003 | MA/NY DDave
Hi Notice they do call out that you should use their thinner. In the MSDS you get a clue as to the thinner they are mostly using with some additives. http://www.kester.com/PDF%20FILES/PDF%20Data%20Sheets/E%20No-Clean%20Fluxes/951%20(30Mar98)logo.p
