Electronics Forum | Wed Nov 04 11:00:00 EST 2009 | tstrat
That is interesting, I have not seen that as a requirement before. From what I read if it is less than 7 wt% the corrosion resistance is pretty low, but if the value is too high it indicates that "black pad" is present from nickel corrosion. From wha
Electronics Forum | Thu Aug 25 17:24:44 EDT 2016 | davef
Gold should not be corroding in salt water. I have swum hundreds of miles in salt water with my wedding ring on my finger. My ring is a shiny and corrosion-free as the day it was cast over 120 years ago. It's possible that your gold thickness of 0.0
Electronics Forum | Wed Feb 01 18:11:43 EST 2006 | Chris
I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vias have pin hole openings or even larger openings, chemicals from the ENIG process could become entrapped in the via holes and not washed away in the
Electronics Forum | Thu Aug 25 18:14:10 EDT 2016 | davef
Shawn ... I believe you. I believe what you're saying. I don't believe that you received the metals that you ordered. From the way it looks I'd guess that you have no nickel and that you're seeing copper corrosion.
Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Jul 15 16:50:04 EDT 2005 | davef
Few of us here on SMTnet fabricate our bare boards. Most of us are assemblers. So, the solderability of the connections of our boards is a BIG issue with us. Our suppliers protect the solderability of the copper by coating the copper to limit the
Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat
I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif
Electronics Forum | Fri Nov 08 17:49:05 EST 2013 | davef
First, it's a surprise that your failure analysis lab thought everything was OK with these boards. They look like shit. Second, a few years ago, there was a bunch of complaints about ENIG boards with issues similar to what you're observing. There wa
Electronics Forum | Mon Oct 20 21:26:57 EDT 2014 | richardciccarone
I have seen a couple of references to Black Tar, Not Black Pad. Apparently, it occurs only on the solder side of PTH's after wave solder and primarily on the edges of the land. It is characterized by a black coloration (Not Ni corrosion?) and non-wet
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