Electronics Forum | Mon Apr 13 09:27:28 EDT 2009 | hxr6038
We had an issue with the finish, PCB manufacturer is telling that they had a problem with the Nickel rework, which resulted in 20% fall out. Please help me by providing the ENIG thickness for Flex boards, is it same as rigid boards as per IPC 4552. I
Electronics Forum | Thu Jan 30 07:19:23 EST 2020 | dontfeedphils
I'd post an image of your current profile if you could. Have you tried a RTS profile instead of a RSS?
Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto
More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.
Electronics Forum | Fri Jan 31 00:20:47 EST 2020 | jineshjpr
Thanks for your response, yet to try with RTS Solder profiles, Have you any additional comments on this RTS Temperature specifications like Time above liquidus, Peak temperature if any..??
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Wed Apr 15 13:07:12 EDT 2009 | RHK
Thank you! I am looking into this, but main idea is to use rigid board in place of flex.
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Thu Aug 25 11:53:12 EDT 2016 | shawn_halo_1
Sorry if I was not clear. We have a Flex Circuit Board that is ENIG Finished. There are two connectors that are SMTd to either side of the Flex to connect to other PCBs within the system. Then, we have conductive rubber contacts that are press fit on
