Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller
We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w
Electronics Forum | Fri Jan 16 16:36:07 EST 2009 | boardhouse
i would not try to chemically clean the finish, you would just be asking for other problems. 1) I would ask your supplier their Hasl mix. Standard Lead hasl is 63/37 - it almost sounds like your boards have a higher content of Tin and your experien
Electronics Forum | Fri Jan 16 13:11:27 EST 2009 | evtimov
HI , A LOT OF SIMILAR ISSUES WERE DISCUSSED LATELY. MOST OF THE TIME THE PROBLEM IS IN THE BOARD FINISH. THE BEST OPTION IS GOLD FINISH(ENIG). MAKE A SAMPLE AND TRY IT WITH BOTH PASTES YOU HAVE. ANOTHER THING I DID BEFORE AND IT HELPED ME PARTIALLY
Electronics Forum | Fri Dec 16 01:36:53 EST 2005 | tk380514
i would assume when the PCB planner and customer would specify what "surface layer type"they want but this section is always empty but i have found that out yesterday that we only use ENIG and not FLASH GOLD, which is good to know........ but it see
Electronics Forum | Wed Sep 03 17:43:19 EDT 2008 | vladig
No, I don't work for Suntech (me company name is different but close, it much have been misspelled:-)) and the company isn't exactly a trace lab, However, that wasn't the point why I �jumped in�. Defining a problem as �solderability� is too generic.
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Mon Feb 09 16:55:28 EST 2009 | cuperpeter
Hi Sachin, thanks for your feedback. According to our supplier, surface plating is electrolytic gold over Nickel(not ENIG), but I think that is a still improper thickness for Au. (according to 3rd Working Draft from September 2008 of IPC 2221B "0.4
Electronics Forum | Mon Mar 17 15:51:35 EST 2003 | MA/NY DDave
Hi A GREAT come back!! After a Wait to see "Show and Tell" To change the topic you launched a little. Who has or has had, this ENIG problem??? A simple yes or no with some detail. YiEng, MA/NY DDave
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