Electronics Forum | Tue Jul 11 20:13:05 EDT 2006 | davef
We agree with Chunks. You need to turn-up the heat [slow the conveyor] because you have significantly changed the melting point of the solder alloy by adding so much gold. Relative to ENIG you should expect: * Similarly smooth surface, possibly a l
Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc
I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike
We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th
Electronics Forum | Thu Feb 05 05:27:55 EST 2004 | dszeto
We have recent customer asking for PCB's PTH hole size related to soldered wire AWG 18-26. Please kindly advise any international standard for captioned issue. Thanks!
Electronics Forum | Wed Mar 10 15:09:34 EST 2004 | Jay
You can say "re-flow". It's related with the process. In order to assemble a PC Board containing lots of components such as PTH (Plated Through Hole) and SMT, usually, PTH type packages and components are soldered first using wave soldering process.
Electronics Forum | Wed Apr 24 13:29:24 EDT 2002 | koujoe
We have been trying to flow some PWBs with pth that have foil on both the primary and secondary sides. What would be the best way to setup the wave solder machine to accomplish this task. for example (solder temp,conveyor angle,conveyor speed)
Electronics Forum | Thu Feb 05 08:39:16 EST 2004 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require.
Electronics Forum | Wed Aug 27 11:25:11 EDT 2008 | blnorman
We use immersion tin boards and ENIG with Sn63Pb37 with no problems. We did have to tweak the profile higher with ImmSn though.
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
