Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci
The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A
Electronics Forum | Mon Jan 22 03:51:16 EST 2007 | Bing
We are using HASL board for Press Fit, without problem in the past until recently. Now we are seeing the solder in the PTH melt and block partially the PTH hole during the reflow. It gives problem when Press Fit. Anyone has advice on this?
Electronics Forum | Mon Apr 27 02:44:07 EDT 2009 | michafogel
Can someone point me to a standard, if there is any, or design rule regards with preffared spacing between PTH and SMT pads for LF wave soldering process (SAC alloy)
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Wed Jul 27 17:18:07 EDT 2005 | Carl
Any issues in your experience using SAC305 for reflow and SN100C for wave on ENIG pcbs? I've seen the CD, but there's not much specific data regarding ENIG pcbs Thanks
Electronics Forum | Mon Nov 10 19:45:51 EST 2008 | davef
Joe On the earlier ENIG comment: No, you're not missing anything. ENIG board are less likely to have copper dissolution issues that other solderability protection.
Electronics Forum | Wed Oct 12 12:33:11 EDT 2005 | Inds
Hi Everyone, I am trying to site dress PTH holes filled with Nihon solder mixed with SAC solder at the rework station. But what i am seeing is the solder just doesn't melt and I am not able to suck the solder out of the PTH. Has anyone faced this i
Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
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