Electronics Forum | Wed May 03 22:14:29 EDT 2006 | davef
We think well done carbon ink and well done ENIG are equally reliable [maybe 1M operations]. If the gold is pourous [not all that an uncommon], ENIG is far less reliable than carbon ink.
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Sat Jul 26 11:40:09 EDT 2003 | mantis
All, Is it possible and reliable to replace bga's on Enig boards with out suffering from mass fallout due to blackpad defect.I have a couple of boards requiring bga replacment but i have been told that it is not possible to replace them reliable that
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Mon Jul 28 16:32:45 EDT 2003 | itempea
Mant, we are reliably replacing BGAs of all sizes and pitches on ENIG. The black pad is not something created through rework, but a defect that the PCB has from the very beginning. Ioan
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Tue Jul 11 20:13:05 EDT 2006 | davef
We agree with Chunks. You need to turn-up the heat [slow the conveyor] because you have significantly changed the melting point of the solder alloy by adding so much gold. Relative to ENIG you should expect: * Similarly smooth surface, possibly a l
Electronics Forum | Tue Jul 29 09:28:24 EDT 2003 | russ
Why would you get black pad from rework? I could be wrong but once the pad has accepted solder from the first reflow process wouldn't that eliminate the possibility of a latent finish defect? I am curious. We do perform rework on ENIG all of the tim
Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm
My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is
Electronics Forum | Tue Nov 03 18:09:17 EST 2009 | gregoryyork
I think most have summed up the first pictures also is the drillng looking like it is misregistered as well. Better to do a solvent test to determine resist cure not the old stuff the newer chemicals show under cure problem much better. Try your st
