Electronics Forum: enig solderability issues (Page 1 of 339)

enig

Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef

The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

enig

Electronics Forum | Fri Oct 14 16:51:46 EDT 2005 | GS

It stands for Elettroless Nikel Immersion Gold, a kind of PCB finishing Entek (there are several kinds) is a brand name of an OSP (Organic Solderability Preservative)kind of PCB finishing. Regards............GS

enig

Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS

Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS

Unusual solderability issue

Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse

Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be

Unusual solderability issue

Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch

Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t

Connector solderability

Electronics Forum | Wed Nov 06 17:50:46 EST 2002 | davef

I hear you on the profiling issue. That won't get at the issue any how. Your observation of solder wetting confirms that solderability is NOT the issue. You may be seeing a "cold solder connection". The issue is the TCE of the different materia

Connector solderability

Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ

This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can

Connector solderability

Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef

First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.

BGA & PCB - solderability issue

Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef

Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an

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