Electronics Forum | Wed Apr 08 14:46:34 EDT 2009 | boardhouse
The things to ask your board supplier would be: 1) Was the Pre-preg material that was used on this board within its Shelf life? and ask for the Incoming inspection CofC for the Pre-preg material. 2)Was this order shipped from Stock - this is why
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed Feb 07 09:37:48 EST 2007 | billyd
Had the very same thing happen the first time we used the small QFNs. The aperture for the thermal pad in the center needs to be cut in a grid form, either squares (with around a 10 mil spacing between openings) or circles, like a BGA pattern. Too mu
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Tue Jul 18 09:29:54 EDT 2017 | svfeingold
That does sound like a great deal Tsvetan. Can you share any information about who/where exactly you purchased the machines, and which printer/reflow you have? I do have friends and colleagues in China that could ease the process if anything is comin
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd
Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door
Electronics Forum | Tue Jun 29 14:44:26 EDT 2010 | rgduval
There are some good suggestions here...reflow pallets, and copper balancing. We would also suggest verifying that your problem is not caused by moisture. How much time passed between first side and second side reflow, and how humid is the environme
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
