Electronics Forum: enig with high phosphorus (Page 1 of 1)

Pb-free wave soldering with SMD

Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc

I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Any PCB manufacturer can do 8 layer 1.0mm PCB with 2/2mil line?

Electronics Forum | Thu Jul 06 23:59:11 EDT 2017 | heros_electronics

We got an inquiry from US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there is 2/2mil lines in inner layers. It's said that this order was

Any PCB manufacturer can do 8 layer 1.0mm PCB with 2/2mil line?

Electronics Forum | Mon Jul 24 20:39:49 EDT 2017 | dawson

We got an inquiry from US that requires high > volume 8 layer 1.0mm PCB, OSP + selective ENIG > surface, 5 groups impedance control, and stacked > vias. These requirements are common, but there is > 2/2mil lines in inner layers. It's said that th

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat

I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif

ENIG Thickness for Flex

Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef

Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs

Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t

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