Electronics Forum | Thu Aug 24 12:53:56 EDT 2006 | russ
yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!! please check your incoming material prior to processing please check your reflow profile to ensure that max temp
Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ
Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w
Electronics Forum | Thu Sep 16 08:47:39 EDT 2010 | headlad
I extended the pads to help ensure the component locates correctly and to allow for easier re-work should problems occur. I reduced the thermal by 5% but you may want to speak to your fabricator and ask what they require to ensure that the resist is
Electronics Forum | Thu Mar 28 19:36:21 EDT 2024 | linux
ensure the nozzle is inserting fulling into the nozzle holder. ensure shaft is lubricated, clean between the magnetics on the shaft. complete nozzle height calibration
Electronics Forum | Mon Nov 20 13:53:13 EST 2023 | carl_p
I would ensure a nozzle is fitted to spindle 1, UIC genesis, Fuzion etc can be a bit funny with this. If that checks out ok, I would be ensuring nothing is obstructing the Z travel. Next would be to ensure the Z motor is at home & again this is wor
Electronics Forum | Sun Jul 28 21:23:41 EDT 2002 | bayanbaru
What are some of the important Frontend (printing to reflow) check list that has to be verify to ensure the process is in control?
Electronics Forum | Tue Nov 09 17:38:01 EST 2010 | davef
What's your stencil thickness?
Electronics Forum | Mon Dec 01 02:54:05 EST 2014 | divia
Yes nano coating giving the good printing, but the stencil tension is very important for the life, 1st ensure the stencil tension...
Electronics Forum | Fri Oct 06 16:49:28 EDT 2017 | joycehughes
In order to ensure that the machine arrives undamaged; what do we need to do?
Electronics Forum | Fri Sep 25 08:34:39 EDT 2020 | SMTA-64386317
Supplier would like to know the appropriate ball height to ensure suit to SMT and underfill process. Undefill using epoxy.
