Electronics Forum | Tue Apr 20 16:41:52 EDT 1999 | Justin Medernach
| I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following cr
Electronics Forum | Tue Apr 20 14:25:05 EDT 1999 | Stephen Smith
I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following crit
Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach
I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the
Electronics Forum | Sun Apr 25 12:01:58 EDT 1999 | Earl Moon
| Earl said, in essence: | | | Justin is absolutely right ... | | | | Again, Entek is not much more than a flux coating ... | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemical come in ne
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
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