Electronics Forum: enthone 2 part ink (Page 1 of 3)

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.

Palladium poor wetting

Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine

Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi

Solder mask

Electronics Forum | Wed Jan 14 18:23:05 EST 2009 | boardhouse

konrad, Here are a couple of things that can affect color. 1) Material color is the major, 2) Matte green from Enthone would be different in shad than Matte green from Taiyo. 3) Solder mask is two parts, One the green mask, two the hardner, having t

Re: Exhausting of flux in reflow ovens

Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima

| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 19 20:49:13 EDT 1999 | Dave F

| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185

Packing material, the right track ?

Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef

Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E

Re: Serial Numbering of PCB's (?)

Electronics Forum | Thu Feb 03 11:20:15 EST 2000 | John O'Brien

This is getting to be a more common practice, especially with the application of a 2-D bar code directly to the board (via laser, ink jet,etc.) Some really major companies are jumping on the bandwagon because it also allows treating each board as a l

question about sound filter for a solo show

Electronics Forum | Sat Sep 27 11:30:06 EDT 2003 | Fede Muelas

Hi, My name is Federico Muelas, I�m an artist working with technology and I�m having a solo show in Barcelona at the end of the year titled �the sound of the chocolate smell� where I�m showing my recent installation pieces, you can check the info of

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol

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