Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Wed Jun 21 14:14:43 EDT 2000 | Gary Hunt
I need to construct test boards for which will be repeatedly subjected to Highly Accelerated Stress Screens, (HASS), and am looking for recommendations for materials. Would an Epoxy Glass or an Epoxy Glass Composite be least suceptible to exposure t
Electronics Forum | Tue Nov 04 08:45:52 EST 2014 | julianf
BUMP, Still looking :)
Electronics Forum | Fri Jul 06 10:18:02 EDT 2007 | blnorman
According to IPC-A-600, measling can occur in epoxy-glass boards when the moisture content of the board is above 0.3wgt%. Is this the industy acceptance standard for max moisture content of a board?
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Thu Jan 23 15:46:35 EST 2003 | MA/NY DDave
Hi Hey I might even know this company. No guarantee since it might be years ago. Another idea is die cutting. Laser, I think CO2, is jazzy since it is programable, yet so is water jet and it has a tad less problem with reflective surfaces like the
Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein
It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.
Electronics Forum | Wed Oct 21 14:28:17 EDT 1998 | Earl Moon
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Mon Dec 18 11:25:19 EST 2000 | Charles Harper
Flame retardant epoxy-glass circuit boards are made using brominated epoxies,with the bromine atoms providing the flame retardancy.In a fire,these boards can give off toxic gases.Bromine free epoxies can be used,with other additives being used to pro
