Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Mon Nov 25 18:43:29 EST 2013 | hegemon
Without the proper tools in house you will not be able to determine anything but the most obvious problems. At minimum, some side looking microscope that would allow visual inspection of a row or two, and to be able to rule out bridging. Using that
Electronics Forum | Thu Nov 19 14:38:49 EST 2009 | doremi
Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are
Electronics Forum | Wed Sep 03 17:09:23 EDT 2008 | glennster
Omid, In some cases we have been able to restore acceptable solderability by dipping the leads (one side at a time) in an active flux and then re-tinning. Usually a good visual inspection after tinning would reveal whether this was going to work.
Electronics Forum | Wed Aug 31 08:27:45 EDT 2011 | rway
AOI if needed? I take it your AOI/AXI is not inline. Too bad. Our AOI is the first line of defense against induced errors in the mfg process. It's invaluable. How do you know it's not needed, or that it won't be needed in the future? Do you hav
Electronics Forum | Tue Feb 25 00:47:35 EST 2003 | Dreamsniper
"We visually inspect and check solderability at incoming." Would you mind sharing how you are doing them? Is it really necessary to inspect visually using a microscope all or every PCB's delivered by the supplier? If not how will we check the qualit
Electronics Forum | Wed Oct 06 11:41:50 EDT 1999 | Bill Haynes
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Tue Feb 25 10:32:09 EST 2003 | davef
I don't know the precise scheme, but it goes something like this ... WHAT TO DO * Use the general work instruction that applies to all boards. It goes into dimension and hole checking processes. It talks to visual instection of solder mask, solder
Electronics Forum | Sat Apr 21 04:39:45 EDT 2012 | brotakul
I am using different equipements for SPI such as Koh Young and Cyber Optics machines. I am looking for implementing a general procedure (SWP) for setting LSL's and USL's on the products on which the customer does not specify any limits on the solder
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