Electronics Forum | Fri May 18 11:58:47 EDT 2007 | ed_faranda
We're starting to get into BGAs at my company. I have worked with BGA with another company, but that was nearly 10 years ago now. One thing I haven't found is the required clearance around BGA components. Is there a standard for this distance? Wha
Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Thu Apr 25 08:57:55 EDT 2019 | scotceltic
Interesting. Makes it easier on design.
Electronics Forum | Fri Apr 26 08:41:18 EDT 2019 | scotceltic
Thanks for all the replies. It has been helpful.
Electronics Forum | Thu Jun 19 13:39:47 EDT 2003 | Steve
So how much clearance between components (in mm) does the Ersascope require? What if you have caps around (2-3mm from the BGA's edge) a BGA . . . is it necessary to remove them prior to inspection of the BGA?
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Mon Aug 22 06:38:21 EDT 2011 | janz
i used to remove one-two columns of the balls leading to the centre of the BGA then slide thermocouple inside. Of course it is highly dependable on your BGA clearance. janz
Electronics Forum | Thu Apr 25 17:17:44 EDT 2019 | spitkis2
Years ago it was common to see 2-3mm keep out areas around BGAs. Now with boards being so densely populated there are no clearance minimums. Regardless if the machine is using convection or IR heating, parts can be reworked without affecting adjace
Electronics Forum | Thu Apr 10 12:49:08 EDT 2003 | Giuliano
I am using the old Tango for DOS to create an board with a 1mm BGA chip. How to define clearance around the surface pads?
Electronics Forum | Tue Jul 24 09:15:47 EDT 2001 | gdstanton
Folks, Does anyone have data to support that a minimum clearance left around the perimeter of a BGA on a board design can improve its solderability? In other words, if X distance is left open (free of components) around the BGA, could ball solderab
