Electronics Forum | Fri Jan 20 13:25:07 EST 2006 | Gary Kemp
The mask/copper layer is exhibiting popcorn blistering following reflow. With profiling we know that the assembly does not see anything close to 250 C, rather around 238 C.
Electronics Forum | Thu Jan 19 20:40:52 EST 2006 | Gary Kemp
We are experiencing a blistering problem during our process of lead free assembly. The customer has supplied us with the bare fab rated at 140 Tg. I am under the assumption that the Tg rating should at minimum be 170. Does anyone know if there is
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Wed Oct 07 15:44:43 EDT 1998 | CW
There's a good article on lead-free assembly of mixed technology in the May issue of SMT Magazine (pg. 52)
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef
To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Sat Jun 12 19:08:11 EDT 2004 | Ken
Well, it finally happened. A machine Operator did not follow our bar code process and "grabbed a tube of solder paste" and guess what. Built 250 assemblies with LF paste when it should have been Tin/Lead!!!! SOLDER PASTE SUPPLIERS: can you make t
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