Electronics Forum | Sat May 01 07:17:03 EDT 2004 | davef
Try rotating [eg, 90*, 180*, etc] the board prior to running it through the oven. Ditch the pallet, as a previous poster suggested.
Electronics Forum | Thu Feb 19 18:07:57 EST 2004 | davef
We're inclined to buy Russ's stuff about peel from the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction thro
Electronics Forum | Wed Oct 19 06:46:27 EDT 2022 | winston_one
What about warpage before reflow? Often the boards with unbalanced copper can be warped initially, and you can reject it... If it's not possible to change the copper, then may be (at least for future lots) it's possible to switch to laminate with hi
Electronics Forum | Mon Feb 11 13:07:30 EST 2013 | deanm
You want your machine to spot the fiducials automatically. A 40mil round copper pad is the absolute minimum fiducial to use, but we found in practice that our Quad equipment won't spot them reliably. I am now using a 60mil round fiducial and it picks
Electronics Forum | Fri Oct 17 14:20:30 EDT 2003 | AXL
Dean and fastek, Thanks for your input. Actually the MPM Accuflex is more accurate than the UP3000 and MPM will tell you that. The machine wasn't intentionally built that way but that is the way it turned out. Oh and Dean, what if the Piper Cub was
Electronics Forum | Mon Jul 31 19:52:51 EDT 2006 | darby
TOOLING > OFFSET. The pcb stopper is attached to the camera and a default stop position is calculated from the PCB dimensions. If your stencil image is offset left or right then you can either fiddle the pcb size or input the offset. Offsets front an
Electronics Forum | Thu Feb 27 14:02:26 EST 2003 | russ
Genny you are right on with the differences between suppliers/packaging etc... I am a CEM and you are correct that we pay no heed to cad rotations from our customers/designers. A.V.L./manufacturers P/Ns information specifies orientations and such.
Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman
If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere
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